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    愛彼電路·高精密PCB電路板研發(fā)生產(chǎn)廠家

    微波電路板·高頻板·高速電路板·雙面多層板·HDI電路板·軟硬結(jié)合板

    報(bào)價(jià)/技術(shù)支持·電話:0755-23200081郵箱:sales@ipcb.cn

    PCB材料

    PCB材料

    370HR高速板材規(guī)格參數(shù)

           370HR層壓板是使用高性能180°C Tg FR-4多功能環(huán)氧樹脂制成的,該材料專為要求大散熱性能,可靠性和耐CAF性能的多層印刷線路板(高速PCB)應(yīng)用而設(shè)計(jì)。 該材料具有出色的熱性能,且熱膨脹系數(shù)(CTE)低,并且其機(jī)械,化學(xué)和防潮性能達(dá)到或超過(guò)了傳統(tǒng)FR-4材料的性能,370HR用于數(shù)千種PCB設(shè)計(jì)中,并且在熱可靠性,CAF性能,易加工性和順序?qū)訅涸O(shè)計(jì)的可靠性能方面被證明是同類產(chǎn)品中最好的。

     

     

    PropertyTypical ValueUnitsTest Method
    Metric (English)IPC-TM-650 (or as noted)
    Glass Transition Temperature (Tg) by DSC180°C2.4.25C
    Decomposition Temperature (Td) by TGA @ 5% weight loss340°C2.4.24.6
    Time to Delaminate by TMA (Copper removed)

    A. T260

    B. T288

    60

    30

    Minutes2.4.24.1
    Z-Axis CTE

    A. Pre-Tg

    B. Post-Tg

    C. 50 to 260°C, (Total Expansion)

    45

    230

    2.8

    ppm/°C

    ppm/°C

    %

    2.4.24C
    X/Y-Axis CTEPre-Tg13/14ppm/°C2.4.24C
    Thermal Conductivity0.4W/mKASTM E1952
    Thermal Stress 10 sec @ 288oC (550.4oF)

    A. Unetched

    B. Etched

    PassPass Visual2.4.13.1
    Dk, Permittivity

    A. @ 100 MHz

    B. @ 1 GHz

    C. @ 2 GHz

    D. @ 5 GHz

    E. @ 10 GHz

    4.24

    4.17

    4.04

    3.92

    3.92

    2.5.5.3

    2.5.5.9

    Bereskin Stripline

    Bereskin Stripline

    Bereskin Stripline

    Df, Loss Tangent

    A. @ 100 MHz

    B. @ 1 GHz

    C. @ 2 GHz

    D. @ 5 GHz

    E. @ 10 GHz

    0.0150

    0.0161

    0.0210

    0.0250

    0.0250

    2.5.5.3

    2.5.5.9

    Bereskin Stripline

    2.5.5.5

    2.5.5.5

    Volume Resistivity

    A. After moisture resistance

    B. At elevated temperature

    3.0 x 108

    7.0 x 108

    MΩ-cm2.5.17.1
    Surface Resistivity

    A. After moisture resistance

    B. At elevated temperature

    3.0 x 106

    2.0 x 108

    2.5.17.1
    Dielectric Breakdown>50kV2.5.6B
    Arc Resistance115Seconds2.5.1B
    Electric Strength (Laminate & laminated prepreg)54 (1350)kV/mm (V/mil)2.5.6.2A
    Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
    ASTM D3638
    Peel Strength

    A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]

    B. Standard profile copper

        1. After thermal stress

        2. At 125oC (257oF)

        3. After process solutions


    1.14 (6.5)


    1.25 (7.0)

    1.25 (7.0)

    1.14 (6.5)

    N/mm (lb/inch)

    2.4.8C


    2.4.8.2A

    2.4.8.3

    2.4.8.3

    Flexural Strength

    A. Length direction

    B. Cross direction

    90.0

    77.0

    ksi2.4.4B
    Tensile Strength

    A. Length direction

    B. Cross direction

    55.9

    35.6

    ksiASTM D3039
    Young's Modulus

    A. Length direction

    B. Cross direction

    3744

    3178

    ksiASTM D790-15e2
    Poisson's Ratio

    A. Length direction

    B. Cross direction

    0.177

    0.171

    ASTM D3039
    Moisture Absorption0.15%2.6.2.1A
    Flammability (Laminate & laminated prepreg)V-0RatingUL 94
    Relative Thermal Index (RTI)130°CUL 796
    The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by 

     

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