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    愛彼電路·高精密PCB電路板研發(fā)生產(chǎn)廠家

    微波電路板·高頻板·高速電路板·雙面多層板·HDI電路板·軟硬結(jié)合板

    報價/技術(shù)支持·電話:0755-23200081郵箱:sales@ipcb.cn

    PCB材料

    PCB材料

    FR408HR高速板材規(guī)格參數(shù)

          FR408HR層壓板是采用高性能多功能樹脂和電氣級(E-玻璃)玻璃纖維織物加固壓制而成。該材料在Z軸擴展方面提高了30%,并且提供了比該領域競爭產(chǎn)品多25%的電帶寬(更低的損耗)。這些特性加上在回流焊時優(yōu)越的防潮性,使得產(chǎn)品能夠從熱和電的角度來提高板的優(yōu)質(zhì)性。


    PropertyTypical ValueUnitsTest Method
    Metric (English)IPC-TM-650 (or as noted)
    Glass Transition Temperature (Tg) by DSC190°C2.4.25C
    Decomposition Temperature (Td) by TGA @ 5% weight loss360°C2.4.24.6
    Time to Delaminate by TMA (Copper removed)

    A. T260

    B. T288

    60

    >30

    Minutes2.4.24.1
    Z-Axis CTE

    A. Pre-Tg

    B. Post-Tg

    C. 50 to 260°C, (Total Expansion)

    55

    230

    2.8

    ppm/°C

    ppm/°C

    %

    2.4.24C
    X/Y-Axis CTEPre-Tg16ppm/°C2.4.24C
    Thermal Conductivity0.4W/mKASTM E1952
    Thermal Stress 10 sec @ 288oC (550.4oF)

    A. Unetched

    B. Etched

    PassPass Visual2.4.13.1
    Dk, Permittivity

    A. @ 100 MHz

    B. @ 1 GHz

    C. @ 2 GHz

    D. @ 5 GHz

    E. @ 10 GHz

    3.72

    3.69

    3.68

    3.64

    3.65

    2.5.5.3

    2.5.5.9

    Bereskin Stripline

    Bereskin Stripline

    Bereskin Stripline

    Df, Loss Tangent

    A. @ 100 MHz

    B. @ 1 GHz

    C. @ 2 GHz

    D. @ 5 GHz

    E. @ 10 GHz

    0.0072

    0.0091

    0.0092

    0.0098

    0.0095

    2.5.5.3

    2.5.5.9

    Bereskin Stripline

    Bereskin Stripline

    Bereskin Stripline

    Volume Resistivity

    A. After moisture resistance

    B. At elevated temperature

    4.4 x 107

    9.4 x 107

    MΩ-cm2.5.17.1
    Surface Resistivity

    A. After moisture resistance

    B. At elevated temperature

    2.6 x 106

    2.1 x 108

    2.5.17.1
    Dielectric Breakdown>50kV2.5.6B
    Arc Resistance137Seconds2.5.1B
    Electric Strength (Laminate & laminated prepreg)70 (1741)kV/mm (V/mil)2.5.6.2A
    Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
    ASTM D3638
    Peel Strength

    A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]

    B. Standard profile copper

        1. After thermal stress

        2. After process solutions


    1.14 (6.5)


    0.96 (5.5)

    0.90 (5.1)

    N/mm (lb/inch)

    2.4.8C


    2.4.8.2A

    2.4.8.3

    Flexural Strength

    A. Length direction

    B. Cross direction

    72.5

    58.0

    ksi2.4.4B
    Tensile Strength

    A. Length direction

    B. Cross direction

    54.5

    38.7

    ksiASTM D3039
    Young's Modulus

    A. Length direction

    B. Cross direction

    3695

    3315

    ksiASTM D790-15e2
    Poisson's Ratio

    A. Length direction

    B. Cross direction

    0.137

    0.133

    ASTM D3039
    Moisture Absorption0.061%2.6.2.1A
    Flammability (Laminate & laminated prepreg)V-0RatingUL 94
    Relative Thermal Index (RTI)130°CUL 796
    The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by 

     

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